Technology & Service
Making the world safer and more convenient by speeding up
communication and diversifying the sensors in information delivery
communication and diversifying the sensors in information delivery
Wafer-Level Packaging Technology for Optic Engines
The chips come with various features, and each chip is utilized by being applied with a different manufacturing process and packaging technology. We expect to apply an identical packaging process for our chips with various features crafted through different methods to create a single integrated module.
To achieve our goal, we at INOPTIX are developing a wafer-level packaging process platform for optic engines. This technology allows us to reconfigure or pick and place the electronic devices (verified chips) and optical devices (verified chips) to a wafer scale level and create electric wiring and optical interfaces.
Our efforts allow us to establish our electronic and optical devices as an integrated package.
To achieve our goal, we at INOPTIX are developing a wafer-level packaging process platform for optic engines. This technology allows us to reconfigure or pick and place the electronic devices (verified chips) and optical devices (verified chips) to a wafer scale level and create electric wiring and optical interfaces.
Our efforts allow us to establish our electronic and optical devices as an integrated package.
