Technology & Service
Making the world safer and more convenient by speeding up
communication and diversifying the sensors in information delivery
communication and diversifying the sensors in information delivery
Glass-based Optoelectronic Fan-Out Packaging (GOFOP™)
The chips come with various functions, and each chip is utilized by being applied with a different manufacturing process and packaging technology. We expect to apply an identical packaging process for the chips with various features crafted through different methods to create a single integrated module.
To achieve the goal, INOPTIX are providing a Glass-based Optoelectronic Fan-Out Packaging Platform (GOFOP™) as a wafer-level packaging process. The GOFOP™ allows us to reconfigure the electronic chips and photonic chips to a wafer scale and an electrical redistribution layer (RDL) and optical interfaces can be formed on Glass substrate.
To achieve the goal, INOPTIX are providing a Glass-based Optoelectronic Fan-Out Packaging Platform (GOFOP™) as a wafer-level packaging process. The GOFOP™ allows us to reconfigure the electronic chips and photonic chips to a wafer scale and an electrical redistribution layer (RDL) and optical interfaces can be formed on Glass substrate.
