Technology & Service
Making the world safer and more convenient by speeding up
communication and diversifying the sensors in information delivery
communication and diversifying the sensors in information delivery
Packaging design and fabrication process services
INOPTIX provides various packaging services.
- Wafer bonding service: BCB bonding, direct bonding
- TO, SMD, Gold Box package
- Chip-scale package
(Wafer bonding)
(TO packaging)
(Gold Box packaging)
(Chip-scale packaging)
